Ricoh create a 31% more efficient heat sink design using ToffeeX

Introduction

As the global shift towards cleaner energy intensifies, advanced thermal management in electronic devices has become critical to meeting higher efficiency standards and ensuring sustainable operation. Ricoh, a leader in additive manufacturing, has partnered with ToffeeX, a pioneer in generative design software, to tackle this challenge head-on. This case study examines Ricoh’s and ToffeeX’s successful collaboration in developing an optimized heat sink design.  The project utilized ToffeeX’s physics-driven generative design software and Ricoh’s Aluminium Binder Jetting (BJT) technology to develop a heat sink that outperforms traditional models by 31% in thermal efficiency, showcasing a significant advancement in thermal management for electronic components. 

Background

Ricoh aims to eliminate greenhouse gas emissions throughout its value chain and assist customers in developing highly energy-efficient products. The shift towards electrification and higher efficiency standards in electronic devices demands innovative approaches to thermal management to achieve a “zero-carbon society.” Traditional cooling solutions, often limited by conventional manufacturing methods, are failing to meet the set goals. 

In 2021, Ricoh unveiled its Aluminium Binder Jetting (BJT) technology, a significant advancement that addresses the limitations of traditional extrusion methods. While extrusion is effective for simpler designs, it can fall short when it comes to the complex shapes required in advanced cooling solutions. BJT technology stands out by producing lighter, more intricate components. It also offers several advantages over other 3D printing processes: it sinters parts without melting, significantly simplifying post-processing. BJT also doesn’t need support structures, which allows a denser arrangement of parts on the build plate, enhancing its suitability for mass production. 

Aluminum has only recently become viable for binder jetting—a substantial breakthrough given its essential role in heat exchange. Ricoh’s BJT technology marks a transformative step in manufacturing complex heat sinks, offering enhanced capabilities over traditional methods.

The project addressed several challenges and opportunities:

1. Adapting to binder jetting’s (BJT) unique requirements: Traditional CAD/DfAM software struggled with BJT’s elimination of support structures.
2. Avoiding TPMS design drawbacks: Ricoh chose not to use a typical TPMS design because they tend to cause higher pressure losses.
3. Employing physics-led generative design: The goal was to explore true physics-led generative design without relying on a predefined geometrical envelope.

Implementation

The goal was to explore new optimized heat sink designs ideal for the Aluminium Binder Jetting Process and to develop a heat sink that significantly outperforms traditional models in thermal efficiency. 

Setting up the optimization in ToffeeX was straightforward, requiring minimal user input. The primary objectives were:

• To minimize CPU temperature
• To minimize pressure loss

Different design solutions were evaluated within ToffeeX by adjusting the relative importance of various optimization targets and constraints. Ricoh tested four different parameter combinations, selecting the optimal design after each iteration, which lasted about 1 hour and 30 minutes.  The design process required less than 7 hours of computational time and a maximum of 30 minutes of actual engineering time to achieve a ready-to-print geometry. ToffeeX’s generative design software enabled the fast exploration of complex, high-efficiency designs that were previously unachievable.

Results

The new optimized heat sink solution demonstrated a 31% improvement in thermal efficiency compared to traditional extruded models. This achievement signifies a breakthrough in heat sink technology. ToffeeX’s generative design capabilities also significantly accelerated the design process, which is crucial in a market where production speed is key.

• Enhanced thermal efficiency: The new heat sink design offers a 31% increase in thermal efficiency compared to traditional models. 
• Improved product performance: Improved heat dissipation capabilities contribute significantly to the performance and longevity of electronic devices.
• Environmental impact: The project aligned with sustainability by using recyclable materials and creating lighter, more efficient heat sinks.
• Market readiness: The heat sinks are ready to meet the market’s increasing demand for green technology.
• Reduced manufacturing time: Ricoh’s technology and ToffeeX’s software decreased the time from concept to production, accelerating the innovation cycle.

Why ToffeeX for this optimized heat sink design?

ToffeeX was chosen for several key reasons that aligned closely with Ricoh’s project objectives and operational needs.

• Advanced generative design capabilities: ToffeeX offers generative design tools for highly efficient and complex geometrical solutions. It combines physics simulation with advanced topology optimization to autonomously design the best solution matching the users’ goals.
• Multi-objective optimization: ToffeeX balances multiple design criteria simultaneously, which is crucial for thermal management applications. This lets you simultaneously design for different performance parameters to meet your requirements.
• Easy integration: ToffeeX’s compatibility with Ricoh’s Aluminium Binder Jetting Technology was decisive. Other design tools couldn’t accommodate the fact that no support structures were needed. ToffeeX also integrated perfectly into their existing workflows.
• Sustainability focus: A significant factor in choosing ToffeeX was its strong emphasis on sustainability, which aligns with Ricoh’s corporate commitment to environmental responsibility. 
• Speed: The AI-powered software uses physics to guide the design process, empowering engineers to create optimized products that meet all their requirements in hours.

Conclusion

The successful development of this optimized heat sink design demonstrates ToffeeX’s potential to meet the exacting demands of thermal management and contribute to advancing sustainable energy solutions. ToffeeX enabled Ricoh’s engineers to quickly produce designs that are not only highly efficient but also simpler to manufacture. Ricoh and ToffeeX’s partnership has set a new standard for thermal management in electronics, proving that high performance and environmental sustainability can go hand in hand. This optimized heat sink design represents a significant step in the industry’s journey towards greener technologies.

About RICOH

Ricoh, headquartered in Tokyo, Japan, is a globally recognized multinational conglomerate renowned for its diverse portfolio spanning imaging and electronics solutions. With a rich history dating back to its founding in 1936, Ricoh has evolved into a leading provider of innovative technologies and services.

Ricoh provides a wide range of services, including imaging products, digital transformation solutions, and Additive Manufacturing capabilities. Their offerings aim to help organizations improve operations, boost productivity, and achieve sustainable growth. They prioritize innovation, utilizing technologies like AI, cloud computing, and IoT to drive competitive advantage. With advanced Additive Manufacturing capabilities, Ricoh facilitates rapid prototyping and customization, transforming traditional manufacturing methods.

With a commitment to sustainability and corporate responsibility, Ricoh actively promotes environmental conservation and social welfare initiatives, striving to minimize its ecological footprint and foster positive societal impact.