Data Center Cooling
The Data Center Cooling Challenge
The demand for computing power is accelerating at a record pace. Yet this revolution runs hot. Data centers already consume 2-3% of global electricity, with forecasts of up to 13% by 2030. Cooling alone accounts for up to 50% of their total consumption. As server densities increase, traditional cooling solutions struggle with hot spots, energy inefficiency, and limited scalability.
Why ToffeeX:
Tailor your heat sink designs to maximize heat extraction where it matters most — directly at the chip surface.
- Lower pressure drop:
Reduce the energy required to run pumps and CDUs - Higher thermal performance:
Extract heat more uniformly and efficiently - Improved reliability:
Keep components within optimal thermal envelopes, even under peak load - Retrofit-ready:
Designs are compatible with existing infrastructure and CDUs, minimizing CapEx disruption
Air Cooling
Direct-to-Chip Cooling
With increased power density at the processor, the more efficient direct-to-chip cooling is rapidly being adopted.
ToffeeX designs maximize heat transfer while minimizing hot spots and pressure drops.
Immersion Cooling
When cooling power is paramount, servers can be immersed in dielectric fluid to enhance cooling further.
ToffeeX allows you to optimize your manifolds and immersion-cooled heat sinks to maximize the potential of the thermal management system.